You must reserve your die location at Science prior to submitting your design. Once the reservation is received, Science will send a confirmation email with further instructions on how to upload your design.

Disclaimers

• The design rules for each MEMS process are designed to maximize the die yield and are defined by the limits of the process. Violation of minimum line/space rules may result in missing, undersized, oversized, or fused features.
• GDS layers that are not labeled according to Science's mask conventions will be ignored. Science is not responsible for outcomes related to naming compliance issues.
• Only the required rules for each process are checked for compliance. Science recommends double checking all of the non-required design rules to decrease the chances of unintended features. Please contact foundry@science.xyz to get DRC/technology files available for Tanner, Cadence, and Mentor CAD software.
• Features and spaces on non-orthogonal axes may not print on wafers at their nominal sizes due to the pixelation of the 0.25 µm photomask resolution. This may cause bridging between closely spaced features in the SOI layer. Science recommends a slightly higher minimum feature and minimum space requirement for non-orthogonal features at 2.5 µm instead of the 2 µm used with orthogonal features.
• Galvanic attack of the polysilicon layers is possible during release if metal is present. Science cannot be held responsible for any effects on die yield caused by galvanic attack during release.