Docs - Science

The Pixel A2K™ chip measures 1.33 mm x 1.33 mm and is designed for flip-chip assembly using bumps.

Bump Locations

Location	No.	Pad name	X (µm)	Y (µm)
LEFT	1	sub	47	1105
	2	vref_low		1025
	3	vref_high		945
	4	dvdd_5v		865
	5	dvdd		785
	6	dvss		705
	7	rstb		625
	8	csn		545
	9	sdin		465
	10	sclk		385
	11	sdout		305
	12	row		225

Pads are located around the chip periphery with 12 power and CMOS I/O pads on the left side suitable for probing (large pads) and flip-chip bonding (small pads). There are 16 small pads on the top side for even-indexed row driver outputs and 16 small pads on the bottom side for odd-indexed row driver outputs. The column driver outputs are located on the right side of the chip arranged in two columns, odd-indexes on the inside and even-indexes on the outside. Four corner pads used for mechanical stability are connected to the substrate of the chip. The exact die dimension and locations of large and small pads used for power and CMOS I/Os and row and column drivers are provided in the mechanical drawing of the Pixel A2K chip, provided as a GDS file under NDA.

Location	No.	Pad name	X (µm)	Y (µm)
BOT	13	rowdrive_odd_15	255	27
	14	rowdrive_odd_14	285
	15	rowdrive_odd_13	315
	16	rowdrive_odd_12	345
	17	rowdrive_odd_11	375
	18	rowdrive_odd_10	405
	19	rowdrive_odd_9	435
	20	rowdrive_odd_8	465
	21	rowdrive_odd_7	495
	22	rowdrive_odd_6	525
	23	rowdrive_odd_5	555
	24	rowdrive_odd_4	585
	25	rowdrive_odd_3	615
	26	rowdrive_odd_2	645
	27	rowdrive_odd_1	675
	28	rowdrive_odd_0	705
TOP	93	rowdrive_even_0	720	1303
	94	rowdrive_even_1	690
	95	rowdrive_even_2	660
	96	rowdrive_even_3	630
	97	rowdrive_even_4	600
	98	rowdrive_even_5	570
	99	rowdrive_even_6	540
	100	rowdrive_even_7	510
	101	rowdrive_even_8	480
	102	rowdrive_even_9	450
	103	rowdrive_even_10	420
	104	rowdrive_even_11	390
	105	rowdrive_even_12	360
	106	rowdrive_even_13	330
	107	rowdrive_even_14	300
	108	rowdrive_even_15	270
RIGHT INNER	29	coldrive_63	1263	192
	31	coldrive_61		222
	33	coldrive_59		252
	35	coldrive_57		282
	37	coldrive_55		312
	39	coldrive_53		342
	41	coldrive_51		372
	43	coldrive_49		402
	45	coldrive_47		432
	47	coldrive_45		462
	49	coldrive_43		492
	51	coldrive_41		522
	53	coldrive_39		552
	55	coldrive_37		582
	57	coldrive_35		612
	59	coldrive_33		642
	61	coldrive_31		672
	63	coldrive_29		702
	65	coldrive_27		732
	67	coldrive_25		762
	69	coldrive_23		792
	71	coldrive_21		822
	73	coldrive_19		852
	75	coldrive_17		882
	77	coldrive_15		912
	79	coldrive_13		942
	81	coldrive_11		972
	83	coldrive_9		1002
	85	coldrive_7		1032
	87	coldrive_5		1062
	89	coldrive_3		1092
	91	coldrive_1		1122
RIGHT OUTER	30	coldrive_62	1303	207
	32	coldrive_60		237
	34	coldrive_58		267
	36	coldrive_56		297
	38	coldrive_54		327
	40	coldrive_52		357
	42	coldrive_50		387
	44	coldrive_48		417
	46	coldrive_46		447
	48	coldrive_44		477
	50	coldrive_42		507
	52	coldrive_40		537
	54	coldrive_38		567
	56	coldrive_36		597
	58	coldrive_34		627
	60	coldrive_32		657
	62	coldrive_30		687
	64	coldrive_28		717
	66	coldrive_26		747
	68	coldrive_24		777
	70	coldrive_22		807
	72	coldrive_20		837
	74	coldrive_18		867
	76	coldrive_16		897
	78	coldrive_14		927
	80	coldrive_12		957
	82	coldrive_10		987
	84	coldrive_8		1017
	86	coldrive_6		1047
	88	coldrive_4		1077
	90	coldrive_2		1107
	92	coldrive_0		1137

Packaging

Bump Locations