Thin Film Electrode Standard Technology

Creating wafers with the TFE process will result in a chip with up to four layers: two polyimide layers and two metal layers.

Cross-sectional diagram of an example thin film electrode design

Layer name Thickness (µm) Purpose
Metal 10.24 This layer is ideal for routing traces and defining electrode sites.
Top metal0.10 This layer is ideal for remetallizing electrode sites and connection pads.
Polyimide 15 This layer forms the base of the device.
Polyimide 25 This layer insulates the routing traces.


Photo showcasing a thin film electrode on a flexible neural array Photo displaying a via detail on a multilayered thin film electrode
Flexible neural electrode array Multilayered polyimide device