Creating wafers with the TFE process will result in a chip with up to four layers: two polyimide layers and two metal layers.
|Layer name ||Thickness (µm) ||Purpose |
|Metal 1||0.24 ||This layer is ideal for routing traces and defining electrode sites.|
|Top metal||0.10 ||This layer is ideal for remetallizing electrode sites and connection pads.|
|Polyimide 1||5 ||This layer forms the base of the device.|
|Polyimide 2||5 ||This layer insulates the routing traces.|
| || |
|Flexible neural electrode array ||Multilayered polyimide device |