| Version | Date | Notes |
|---|
| 1.03 | 12/22/23 | - Units of subdicing graphics corrected to be mm. This is a purely graphical change and does not indicate a change to the process itself.
|
| 1.02 | 9/26/23 | - Process graphics updated to show the pad oxide layer enclosing via holes. This is a purely graphical change and does not indicate a change to the process itself.
|
1.01 | 5/31/23 | - "Designed-in subdicing" added to Piezo MEMS process to parallel the SOI MEMS options.
- FAQ now properly lists aluminum as the pad metal material.
|
| 1.00 | 3/10/23 | - Initial document release.
|
This preliminary product datasheet may change without notice.