Science Foundry

Build on Science's advanced MEMS capabilities for your own research or product development

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Graphic showing a transition between the conceptual, line art of an electrode and the final, realized product.

Science Foundry is your fastest path from design to device

Iterate in weeks, not months, with no upfront investment required.

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Operators in bunny suits and goggles are seen working around microscopes. Operators in bunny suits and goggles are seen working around microscopes.

More than 80 tools spanning broad capabilities

LPCVD films

Important films, deposited on both sides of the substrate, provide excellent conformal coating, high breakdown and dielectric isolation.

  • Low stress nitride

  • Low temperature oxide

  • Low stress polysilicon

  • Phosphosilicate glass (PSG)

Clean room operator inspecting the inside of a machine. A microscope with four objectives is prepared for use.

Post processing

Tools designed for soft contact can place sensitive devices on substrates or packages or subdivide a chip.

  • Dicing

  • HF liquid release

  • Critical CO2 drying

Lithography

Process by which a light-sensitive polymer, called a photoresist, is exposed and developed to form 3D relief images on the substrate.

  • Contact lithography

    Negative/positive resists, SU-8 and polyimide processing

  • Projection lithography

    Negative/positive resists, SU-8 and polyimide processing

  • Backside alignment

    Negative/positive resists, SU-8 and polyimide processing

Polymer films

Polymeric films are defined as thin continuous materials typically up to 200 μm (0.008 in.) thick.

  • Polyimide

  • Parlyene-C

  • Backside alignment

Dry etching

Removal of plastic or other semiconductor material using plasma as opposed to chemical treatment.

  • DRIE

    Si

  • RIE

    Poly-Si, SiO2, SiN, Polyimide, Parylene, and more

  • Plasma cleaning

    Plasma ashing is also possible

Efficient, software-enabled custom process development

Metallization

Metal Deposition. After devices have been fabricated in the silicon substrate, connections must be made to link the circuits together.

  • Evaporation

    Au, Cu, Ti, Cr, Pt, Ni, Al

  • Sputtering

    Cr, Au, Ti, TiW, Cu

A stack of polished wafers are stashed vertically in organized dividers.

Wafer bonding

Attachment of two or more substrates or wafers to one another through a range of physical and chemical processes.

  • Fusion

  • Glass-glass

  • Silicon-glass

  • Eutectic

  • Anodic

Currently tooled for 6 inch wafer size

Metrology

The science of measurement, embracing both experimental and theoretical determinations at any level of uncertainty.

  • SEM

  • Profilometry

  • Infrared inspection

  • Interferometry

  • Film analysis

    Film stress, thickness, or resistivity

Wet etching

Material removal process that uses liquid chemicals or etchants to remove materials from a wafer.

  • Si etching

    KOH

  • Wet oxide etching

    BOE, HF, HCl

  • Wet metal etching

    Au, Cr

  • Immersion cleaning

    SC1, HCL

  • Spray & solvent cleaning

Stacks of finished product sit in neat packages.

Thermal processing

Temperature treatments for metal or silicon, customized to deliver specific material properties.

  • Silicon oxidation

  • Annealing

Two operators discuss technique outside the clean room.

Custom technologies backed by decades of experience and process documentation to make designing as simple as possible.

Scanning electron microscope photo of patterned vias in the dimpled surface of a thin film electrode.

Thin-Film Electrodes

Three masks, two polyimide layers, and two metal layers create an ideal set up for fast and easy electrode designs.

Scanning electron microscope photo of a linear stepper motor.

Poly

Eight masks, three polysilicon layers, and one metal layer can be modified for the highest degree of customization.

Scanning electron microscope photo of three cantilevers, one patterned with piezoelectrics.

Piezo

Five masks, a SOI wafer, and distinct metal and piezoelectric layers offer an efficient ecosystem for piezo designs.

Scanning electron microscope photo of a reflecting square applied over an actuated platform.

SOI

Four masks, a SOI wafer, and two metal layers provide a structured approach to silicon designs.

Scanning electron microscope photo of two rotating components over a trench.

Custom Processes

Design with near limitless potential by synthesizing several of our capabilities towards your design needs.

Graphic showing a transition between the conceptual, line art of an electrode and the final, realized product.

The fastest path from design to

  • biosensing
  • quantum computing
  • aerospace
  • telecommunications
  • neural engineering

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