Important films, deposited on both sides of the substrate, provide excellent conformal coating, high breakdown and dielectric isolation.
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More than 80 tools spanning broad capabilities
Tools designed for soft contact can place sensitive devices on substrates or packages or subdivide a chip.
Process by which a light-sensitive polymer, called a photoresist, is exposed and developed to form 3D relief images on the substrate.
Polymeric films are defined as thin continuous materials typically up to 200 μm (0.008 in.) thick.
Removal of plastic or other semiconductor material using plasma as opposed to chemical treatment.
Efficient, software-enabled custom process development
Metal Deposition. After devices have been fabricated in the silicon substrate, connections must be made to link the circuits together.
Attachment of two or more substrates or wafers to one another through a range of physical and chemical processes.
Currently tooled for 6 inch wafer size
The science of measurement, embracing both experimental and theoretical determinations at any level of uncertainty.
Material removal process that uses liquid chemicals or etchants to remove materials from a wafer.
Temperature treatments for metal or silicon, customized to deliver specific material properties.
Custom technologies backed by decades of experience and process documentation to make designing as simple as possible.
Three masks, two polyimide layers, and two metal layers create an ideal set up for fast and easy electrode designs.
Eight masks, three polysilicon layers, and one metal layer can be modified for the highest degree of customization.
Five masks, a SOI wafer, and distinct metal and piezoelectric layers offer an efficient ecosystem for piezo designs.
Four masks, a SOI wafer, and two metal layers provide a structured approach to silicon designs.
Design with near limitless potential by synthesizing several of our capabilities towards your design needs.