Three masks, two polyimide layers, and two metal layers create an ideal set up for fast and easy electrode designs.
TFE Documentation
Our Standard Technologies platform is a set of four well-characterized MEMS fabrication processes that provide a proven platform for building innovative new devices. We offer regularly scheduled multi-project wafer runs of our SOI, Poly, and Piezo Technologies, as well as dedicated Thin Film Electronics wafer runs and custom process development.
Scheduled Standard Technology runs deliver the fastest turnaround times and most thorough characterization, while dedicated wafer runs provide complete control of the process, larger designs, and a straightforward path to productization.
TFE Documentation
Poly Documentation
Our team of experts can help you develop a custom process that meets your specific needs. Experienced with integrating a wide range of materials and processes, we can help you design and fabricate MEMS devices that are tailored to your application.
Learn About Our CapabilitiesWe are ISO9001:2015 certified by Amtivo (USA) Inc. and believe a commitment to quality goes beyond mere process; our size uniquely positions us to dedicate specialized attention to each of our customers.
Micro Electro-Mechanical Systems, or MEMS, are micron scale integrated devices with small moving parts that allow them to sense changes and directly impact their environment.
Many modern electronic devices include MEMS components for sensing things like motion, pressure, and temperature. They offer an advantage over traditional sensors because they are smaller, more efficient, and more reliable. MEMS are used in a wide range of applications, from consumer electronics to medical devices and industrial equipment.
Intuitive and comprehensive suite of tools to design, program, and run neuroscience experiments.
Electronics that process, store, and transmit signals between probes and the network.
Tissue-contacting elements designed for high precision detection and stimulation of neural signals.
Manufacturing, assembly and packaging of micro scale MEMS and IC devices.