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Partner with Science Foundry to scale your prototype to production

Science Foundry works with clients across diverse industries, guiding projects beyond the scope of our Standard Technologies from concept to full-scale production.

Our engineers bring specialized expertise and hands-on support to every stage of development, complementing the wide range of advanced tools and capabilities available at Science Foundry. With deep knowledge in material and layer integration, we can create bespoke solutions utilizing non-standard materials rarely available in CMOS foundries—such as gold, noble metals, polymers, piezoelectrics, glass, quartz, III-N semiconductors, and more.

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Graphic showing a transition between the conceptual, line art of an electrode and the final, realized product.

Production Process Overview

Production Volume

Chart showing how production volume increases. Chart showing how production volume increases.

  1. Feasibility Review

    Review prototype specifications and process flow to determine feasibility in our fab.

  2. Development Runs

    We collect data, identify issues, and adjust tools as we repeat the production process at least three times.

  3. Pre-Production

    Process validation at a large scale and any final adjustments before full-scale production.

  4. Production

    Production of devices at desired volume and schedule based on agreed specifications. 10s to 1000s of wafers.

More than 80 tools spanning broad capabilities

LPCVD films

  • Low stress nitride

  • Low temperature oxide

  • Low stress polysilicon

  • Phosphosilicate glass (PSG)

Clean room operator inspecting the inside of a machine. A microscope with four objectives is prepared for use.

Post processing

  • Dicing

  • HF liquid release

  • Critical CO2 drying

Lithography

  • Contact lithography

  • Projection lithography

  • Backside alignment

Polymer films

  • Polyimide

  • Backside alignment

Dry etching

  • DRIE

    Si

  • RIE

    Poly-Si, SiO2, SiN, Polyimide, Parylene, and more

  • Plasma cleaning

    Plasma ashing is also possible

Currently tooled for 6 inch wafer size

Metallization

  • Evaporation

    Au, Cu, Ti, Cr, Pt, Ni, Al

  • Sputtering

    Cr, Au, Ti, TiW, Cu

A stack of polished wafers are stashed vertically in organized dividers.

Wafer bonding

  • Fusion

  • Glass-glass

  • Silicon-glass

  • Eutectic

  • Anodic

Efficient, software-enabled custom process development

Metrology

  • SEM

  • Profilometry

  • Infrared inspection

  • Interferometry

  • Film analysis

    Film stress, thickness, or resistivity

Wet Etching

  • Si etching

    KOH

  • Wet oxide etching

    BOE, HF, HCl

  • Wet metal etching

    Au, Cr

  • Immersion cleaning

    SC1, HCL

  • Spray & solvent cleaning

Stacks of finished product sit in neat packages.

Thermal processing

  • Silicon oxidation

  • Annealing

Two operators discuss technique outside the clean room.